Detailed Product Description

• HeraSol® features excellent properties such as high efficiency and high fill factor.
• HeraSol® provides the best suitable silver paste with a wide range of emitter sheet resistance (45 ~ 75 ohm/sq) from deep and shallow emitter.
• HeraSol® provides high aspect ratio and fine line resolution solution for screen printing process.
• HeraSol® easily penetrates the anti-reflective coating during the contact firing process and provides excellent contact properties such as low series contact resistance and high shunt resistance obtaining excellent fill factor.
• HeraSol® has excellent peel strength to provide superior adhesion properties on wafers with eliminating failure mode.
• HeraSol® has excellent solderability with most of leaded and non-leaded interconnect wires.
• HeraSol® provides completely Cd-free and Pb-free pastes
• HeraSol® provides a wide processing window which is easily compatible with various types of back-side BSF (Back Surface Filed) Al contact paste and back-side Al-doped Ag tabbing conductive paste.
• Heraeus mastership rheology paste technology enables the best customization for each solar cell manufacturer.
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