Detailed Product Description

• Screen printable Aluminum paste with a proven track record in worldwide solar market.
• Mastership powder technology enables the best customization for each solar cell manufacturer.
• Excellent electrical and mechanical properties such as high efficiency and ultra low-bowing.
• Ensuring high Voc (open circuit voltage) provided by an excellent BSF (Back Surface Field) quality tailored by the state of the art Al powder technology tuned by flexible powder parameters like size, shape, and distribution functions.
• Realizing extremely low-bowing such as ~0.3 mm bowing on 156 mm X 156 mm wafers at 200 µm thickness and ~1.3 mm bowing on 156 mm X 156 mm wafers at 160 µm thickness.
• Excellent peel strength to provide superior adhesion properties on wafers eliminating failure mode such as blistering and beading during contact firing process.
• Environmentally friendly Cd-free and Pb-free products
• Providing a wide processing window which is easily compatible with a variety of front-side silver conductive pastes and Ag-Al tabbing conductive pastes.